Extrusion-based 3D printing can vertically align 2D nanosheets to improve heat and electricity transport perpendicular to the sheet plane, report researchers at the University of Maryland.

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Among the many uses, the researchers suggest that it could accelerate the cooling of CPU chips in circuits, by transporting the heat vertically away from the source.

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In their recent ACS Nano paper, the researchers led by Liangbing Hu describe a method to obtain 2D materials oriented vertically, and use boron nitride (BN) nanosheets as a proof of concept, proposing a solution to an issue that is a significant challenge and limiting factor in the application of 2D materials.

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The new methodology One of the problems with solution-based self-assembly processes is that they are highly inefficient at generating ordered structures in the vertical orientation. As an alternative technique, […]

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